Bare chip test techniques for multichip modules

A unique bare-chip test methodology has been developed based upon the GE high-density interconnect (HDI) technology. This methodology allows at-speed testing and screening of complex ASICs (application-specific integrated circuits) and microprocessor chips over the full military temperature range in standard chip-carrier test sockets without any special fixturing or probe cards or in clusters of common chips in a test array. The authors describe the HDI packaging approach and how it is being utilized to perform bare-ship pretest of RAM chips, processors, and complex ASICs and how it can be utilized to provide full preassembly burn-in.<>