Automatic testing of metalized ceramic-polyimide (MCP) substrates

The automatic testing and handling of MCP substrates are discussed. The product and the manufacturing processes are described, and he challenges of testing the product and the defect mechanisms are discussed. The specific electrical tests done on the product are examined. Automatic product handling is discussed along with the technology involved with contacting the product. The test electronics and computer control are also described. every substrate is electrically tested twice. It is tested once after all of the photolithographic and wet processes but before pinning and tinning (midline test), and once before it is put on stock (end of line test).<>