Optical components-the new challenge in packaging

Recent developments in the packaging technology for optical components used in fiber transmission systems are reviewed. Topics covered include fiber coupling and fixing techniques, modular packaging concepts, high-speed component design, and advanced-function components. A high-performance package for lithium niobate modulators that illustrates the packaging concepts outlined is described. It is noted that the greatest challenge to date has been the need to develop new packaging techniques for the precision alignment and fixing of optical devices and fiber to tolerances that are at least an order of magnitude more critical than those encountered in the packaging of conventional electronic devices. The development of new die-bonding techniques has been required for handling unusual materials and large chips, and very-high-speed packaging and interconnection technique are evolving to meet the requirements of high-capacity systems. Other developments include the use of modular techniques for increasing the versatility of packaging technology, and the development of single-package advanced-function devices that simplify the use of optoelectronic devices by incorporating interface and control circuits. Likely future trends in optical communications are discussed, and the implications for component packaging are considered.<>