Effect of annealing and alloying to the microstructural property of gold bond wire in wire bond interconnect

This paper investigates the microstructural and mechanical properties of gold and copper that influence bondability performance and junction reliability of wire bond interconnect. The bond wire microstructural and mechanical properties can be controlled by the annealing process to establish the effect of recovery, grain growth and the recrystallization. The addition of 1% palladium to gold wire has improved recrystallization temperature from 350/spl deg/C to 550/spl deg/C.