3GHz through-hole signal via model considering power/ground plane resonance coupling and via neck effect

We describe an equivalent circuit model of a through-bole signal via in a multi-layer printed circuit board (PCB) for frequencies up to 3 GHz. In addition to the via itself, power/ground plane (parallel plate cavity) resonance and via neck effects are also reflected in the model. The model parameters are extracted by S-parameter measurement and a subsequent optimization fitting process. With the proposed model, the signal coupling to the power/ground plane resonance can be accurately estimated. Furthermore, it is demonstrated by near-field probe measurement that the radiated emission from the edge of power/ground planes has intimate correlation to the through-hole signal via.