Co-integration of acoustic-optic functional devices with semiconductor photodetector using film bonding

In this paper, we report a basic study on fabrication technology of the acousto-optoelectronic integration circuit, in which semiconductor optoelectronic devices and acousto-optic devices are integrated on the piezoelectric substrate by film bonding technology. We proposed the novel film bonding process using a water glass as an adhesive material and investigated process conditions such as concentration and treatment temperature of the water glass etc. The experimental results indicated that this film bonding process enhanced binding strength between GaAs film and piezoelectric substrate, and improved the stress distribution in the GaAs film.