Worldwide markets for wafer level packages

With increased demand for small form factor packages at low cost, wafer level packaging has emerged as the package of choice for many devices. Wafer level packages can be examined by package construction: redistribution/bump, copper post/bump with epoxy resin, encapsulated bond, and encapsulated beam lead. Production examples of each type of package construction in volume production are detailed. The paper addresses the drivers for wafer level packaging - today and in the future. Discussed is the proliferation of wafer level packages for low pin count devices and barriers for expansion including wafer level testing.