A novel method for fabrication of a hybrid optoelectronic packaging platform utilizing passive-active alignment

We present a novel fabrication method for a hybrid optoelectronic packaging platform using a combination of passive and active alignment. V-grooves on a silicon optical bench facilitate coarse passive alignment, while on-board thin-film heaters enable final active alignment. The passive-active alignment technique ensures /spl sim/50% peak-coupling efficiency from a semiconductor laser diode with a single-mode conically lensed fiber, making it a low-cost packaging solution appropriate for a variety of optoelectronic modules.