Reliability of manufacturing 6 inch InGaP HBTs

Reliability tests for production level 6 inch InGaP HBTs have been investigated. 6 inch InGaP HBTs have been fabricated and qualified in terms of etching and DC/RF performance uniformity before the reliability test issues. A three temperature accelerated test has been performed to predict MTTF at a certain temperature using the Arrhenius expression. The extrapolated MTTF at a junction temperature 125/spl deg/C is 1.5/spl times/10/sup 8/ hours with an activation energy of 1.98 eV. Furthermore, humidity stress tests were also carried out.