Circuit design and parameters in thin-film technology

The technology of thin-film electronics is aimed at a reduction of the physical size and production costs of electronic equipment as well as at increased reliability and improved performance. This paper will show how complex logic functions can be obtained by integrating many thinfilm circuits of one type at the panel level. This can be accomplished by altering the thin-film interconnection pattern from panel to panel, while retaining the basic circuit configuration throughout. Familiar design techniques for lumped parameter networks can be utilized. The design of an integrated thin-film panel will also be described. To demonstrate the feasibility of fabricating an integrated film assembly, a logic test vehicle (integrated counter assembly) was designed utilizing a 56 trl-NOR panel design.