A fine pitch probe technology for VLSI wafer testing

The limitations of the cantilevered wire probe card with respect to both pin count and pin pitch are pointed out. The authors then present the structure and electric characteristics of a novel wafer probe card and its prototype with 80- mu m pitch and 479 electrodes, obtained by etching a photosensitive transparent glass. With this probe-card technology it is possible to probe LSI with higher pin count and finer pitch pads.<>