Multi-Physics Simulation Workflow for PCB Acoustic Vibrations Induced by Components

Integrating multiple sensors and antennas in high-tech devices increases susceptibility to internal noise and vibrations. Printed circuit board (PCB) vibrations arise from electromagnetic and mechanical interactions in components such as multilayer ceramic capacitors (MLCCs) and power inductors. These interactions-driven by the piezoelectric effect, magnetostriction, and Lorentz forces-coupled with PCB resonances, leading to structural deformations and acoustic emissions. Unlike traditional force-extraction methods, this study directly simulates force fields by applying signals to components, enabling more accurate predictions of PCBinduced vibrations. A multi-physics simulation framework integrating electromagnetic, structural, and vibroacoustic analyses is presented to evaluate and mitigate PCB vibrations. The proposed approach enhances the understanding of forceinduced PCB oscillations, providing design insights for improving structural integrity and electromagnetic compatibility (EMC) in electronic devices.