Profile Optimization and Numerical Analysis of a Novel Asymmetric Rotor for Claw-type Dry Vacuum Pumps in Semiconductor Manufacturing

Claw-type dry vacuum pumps are extensively utilized in semiconductor manufacturing due to their oil-free operation, high pumping speed, and low maintenance requirements. They play a crucial role in semiconductor manufacturing and advanced packaging processes, such as Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), Photolithography and Dry Etching, where precise vacuum control is essential for ensuring process stability and yield. However, traditional claw vacuum pumps are susceptible to wear when operating in particle-laden environments, leading to reduced performance and reliability. To address this issue, this study proposes an asymmetric incomplete meshing rotor design, aimed at enhancing durability and efficiency under such conditions. By optimizing the pitch circle radius ratio and the linear inclination angle of the claw tip, the parametric equations governing the new rotor geometry are derived. Numerical simulations are conducted to analyze its working process and performance characteristics. The results demonstrate that the optimized rotor achieves a volume utilization increase to 41.55%, significantly reduces pressure fluctuations during the mixing stage, and enhances particle passage efficiency. The asymmetric claw-type rotor design effectively improves pressure and velocity distributions, achieving a 42.35% reduction of the peak pressure in the residual clearance chamber, while enhancing the pump efficiency and reliability. The proposed rotor design not only reduces energy consumption and extends equipment lifespan but also enhances process stability in semiconductor manufacturing, particularly in vacuum-based deposition, and other advanced packaging applications. These findings provide valuable insights for the development of high-performance claw-type dry vacuum pumps in semiconductors and related industries.