Research on dual-sided heat dissipation of power devices based on Panel-level package

With the development of power electronic devices towards high power density and miniaturization, the increasing power has made the heat dissipation problem of electronic devices more serious. The heat dissipation performance of electronic products directly affects their performance and lifetime. Panel level Fan out Package (FOPLP) is a new packaging solution that does not use traditional bonding wires and copper clip soldering processes, but instead uses electroplated copper interconnect technology to facilitate the double-sided heat dissipation characteristics of the product, meeting the requirements of miniaturization, integration, and high performance of power de vices. This article studied the double-sided heat dissipation structure of MOSFET products through simulation methods, conducted preliminary verification of the manufacturing process, formulated the optimal packaging processing plan, and completed the processing and functional testing of Si MOSFET samples. The results indicate that the dual sided heat dissipation structure design using FOPLP packaging technology effectively reduces the packaging thermal resistance of the product and improves reliability. The above research provides a certain theoretical basis for the subsequent mass production activities using FOPLP technology.