Design of honeycomb microchannel radiator with tesla valve

As electronic devices become more integrated, improving thermal performance has become a key challenge in advanced packaging. In this study, we designed three honeycomb microchannels with Tesla valves by adjusting the valve proportion for fan-out packaging. We also designed a direct passage as the control group. Using finite element simulations, we analyzed temperature distribution and pressure drop across the microchannels, while temperature uniformity was measured quantitatively with the standard deviation. To further optimize performance, we tested different design parameters, including channel smoothness, depth, width, and honeycomb angle. The results show that adding more Tesla valves improves temperature uniformity but increases pressure drop. Smoothing channel edges and corners not only enhances heat dissipation but also reduces pressure drop. We also found that thermal performance improves as channel depth increases below 0.25 mm, while wider channels (below 0.2 mm) demonstrate better heat transfer. Notably, the microchannel achieves the best overall thermal performance when the honeycomb angle reaches 140°.