High-Performance Epoxy Molding Compound Localization: Technological Breakthrough and Industrial Validation for Semiconductor Supply Chain Autonomy

In the context of the global semiconductor industry chain confronting dual challenges of supply chain security and cost optimization, the localization of epoxy molding compounds (EMC) has emerged as a critical pathway to overcome technological barriers and enhance the industry's self-reliance and controllability. Given the long-standing reliance on imported high-end EMC, this study systematically conducted substitution validation for domestic EMC as an alternative to Sumitomo EMC-G760 Type L. By investigating core enterprises in the domestic EMC production sector, five types of domestically produced EMC with significant substitution potential were identified. Through comprehensive comparisons of the molding process, cutting process, and temperature cycling tests under extreme conditions (-65°C [10 min] to 150°C [10 min]) across 100, 300, 500, 700, and 1000 cycles, it was determined that EMKG900L EMC exhibited equivalent performance to imported G760 Type L materials in terms of surface smoothness and demolding efficiency during the molding process. Notably, no delamination occurred after 1000 temperature cycles (-65°C [10 min] to 150°C [10 min]). Samples prepared using this type of EMC successfully passed the entire certification process outlined in the "General Specification for Semiconductor Integrated Circuits by Qualified Manufacturers." This research not only substantially mitigates supply chain risks and reduces production costs but also facilitates advancements in domestic EMC technology toward high-end applications. Furthermore, it provides industrial verification data to support the localization of high-end EMC, thereby contributing to the dual objectives of "self-reliance and controllability" and "cost optimization" in the semiconductor materials domain.