Impact of Dimensional Effect, Local Temperature and IMC Growth on Electromigration-Induced Degradation in SACQ Solder Ball : A Correlation Analysis

This study investigates the electromigration (EM) behavior of Sn-4.0Ag-0.5Cu-3.0Bi-0.05Ni solder interconnects through comprehensive microstructural characterization. The variety of dimensional evolution, localized thermal effects, and intermetallic compound growth during EM-induced degradation is systematically examined using quantitative correlation analysis and electron backscattered diffraction (EBSD). Experimental results demonstrate a strong dependence of solder joint dimensional evolution on both local temperature variations and IMC layer development. EBSD analysis reveals significant EM-induced microstructural modifications, including pronounced grain growth and crystallographic orientation changes.