A High-Density 3D Capacitor Using Through Glass Via Structure

Glass substrates offer excellent properties for high-density package applications due to their low coefficient of thermal expansion, nanometer-scale surface flatness, and minimal dielectric loss. These characteristics make glass substrates well-suited for integrated passive devices. This study presents a high-density 3D via capacitor embedded in a glass substrate. The through-hole glass vias (TGVs) are conformally lined with a TiN/HfO₂/TiN stack, using processes that are fully compatible with standard TGV fabrication techniques. The fabricated device exhibited an aspect ratio of 16:1 and achieved a measured capacitance of up to 9.7 nF within a 275 μm × 220 μm area, corresponding to a capacitance density of 160.33 nF/mm². Measured electrical performance included an ESR of 237 mΩ and a breakdown voltage of 6.31 ± 0.5 V, demonstrating its suitability for decoupling and power integrity applications.