Packaging Technology and Evaluation Result of Ultra-Compact Double-Side Cooled Power Module

In response to the demand for higher power density of inverters for EVs, we have developed the 1200V/200A 2-in-1 double-side cooled power module that uses SiC-MOSFETs. In addition to the C) Chip Size Package (CSP) technology reported in ISPSD2024, this power module uses four newly developed mounting technologies: A) fin-integrated insulating substrate technology using molten aluminum, B) insulating technology using polyimide film, D) micro bumps bonding technology, and E) laser welding technology. These packaging technologies realize to simplify the manufacturing process and achieve high power density at the same time. We have confirmed this power module has excellent performance. Furthermore, we have developed an inverter system for driving motors that uses a newly developed power module, and we have achieved an efficiency of 98%.