Integration Methods for Co-Packaged Optics using Sin-to-Polymer Waveguide Coupling

We present broadband silicon-nitride to polymer waveguide adiabatic coupling interfaces with sub-1 dB loss around 1310 nm, validated using two integration methods: lithography and flip-chip bonding, achieving sub-2dB chip-to-chip and chip-to-fiber coupling loss. Keywords: Photonic integrated circuits, Photonics-Electronics integration, Packaging technology of photonic devices and circuits, Tapered and grating waveguides for optical coupling, Si photonic and heterogeneous platform, On-board optics and co-packaged optics for high-capacity interconnects