Multi-PCB Modular System Design for Vehicle Connectivity Evaluation

The automotive industry is undergoing rapid evolution in terms of technology and innovation. Connected vehicles and V2X systems depend entirely on precise centimeter-level positioning. The advancement of semiconductor technology and microelectronics, in the form of compact wirelessly connected System-on-Chip (SoC), opens numerous opportunities for various Internet of Things (IoT) applications. This paper proposes a hardware design and architecture developed on the Altium platform using multi-PCB design technologies. The results achieved include a multiconfiguration module targeting assembly of three primary modules: an OBD/vehicle connectivity module with an IMU sensor, a Wi-Fi and RF module equipped with GPS, and a dashboard RF module with Long-Range Wireless Connectivity and a display. The system can also be configured as an all-in-one solution. Each module incorporates the latest wireless SoC from Espressif and can communicate wirelessly with one another. As a comprehensive system, the proposed solution is capable of leveraging vehicle data shared on the CAN network, calculating the inertial motion dynamics of the vehicle, receiving RTK for GNSS, and providing precise positioning, along with a clean and straightforward HMI to report status.