Etch Solutions for High Bow Wafers Bonded On Glass Carrier for Heterogenous Integration

Heterogenous integration is driving an inflection within the semiconductor industry, enabling more compute capability through system on chip (SoC) solutions and integration of logic and memory dies. These evolving packaging technologies require semiconductor tools to be able to handle complex wafer stacks with and without glass carrier wafers, for unit processes. In this work, we have successfully demonstrated a high-volume manufacturing qualified technology able to handle and etch complex substrates with high bow, weight, and thickness, with and without glass carrier wafers.