A New, Fully molded IPM with 7th Generation IGBTs and Diodes

This paper introduces the new generation CIPOS(TM) Mini intelligent power module (IPM) family. It integrates six IGBT7 switches, six emitter-controlled (EC7) diodes, and a 6-channel silicon-on-insulator (SOI) gate driver. The module provides high mechanical robustness thanks to its external and internal structure. The 7th generation IGBT and diode devices use the micro-pattern trench technology combined with improved softness characteristic, which results in reduced power losses. The upgraded mold body and lead-frame design improve robustness against mechanical stress. In this paper, the electrical and thermal performance of the device and its robustness against mechanical stress will be explained.