Automation-Optimized Design for 62mm Power Modules Enabling Enhanced Performance

This paper presents an ultra-compact substrate design and automation-friendly assembly process for classic 62 mm IGBT modules, improving electrical performance and reliability. The design minimizes space for gate connections by implementing gate tracks in the third dimension, maximizing space for power devices. The compact integration achieves a low internal stray inductance of Ls = 10 nH, and reduced connection resistance. This approach enhances power density while improving manufacturing automation and ensuring robust electrical connections. Structural and electrical characterization confirms module’s integrity and reliability, which power cycling and switching performance tests validate its high-current handling capabilities. The proposed design significantly enhances performance, manufacturing efficiency making it a strong candidate for next-generation power electronics.