Low-Cost Transceiver Integration for Next Generation Passive Optical Network

We demonstrate a transceiver with optics and electronics directly assembled on a low cost Printed Circuit Board (PCB) instead of the conventional TO-can. The PCB has a cut-in cavity for the electro-absorption modulated Laser (EML) which is thermally stabilized by a micro-TEC separated from the driver/TIA on the PCB. In this way, we show greatly reduced power consumption of the module whilst shortening the RF interconnect to the laser and improving the electro-optic (EO) bandwidth of the transmitter. The transceiver operates at 25 Gbps NRZ with less than 0.4 dB optical power variation when the ambient temperature varies from 25C to 75C. BER link performance is unaffected by transceiver operating temperature.