Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials

Residual stresses inevitably develop in thermosetting materials used for semiconductor packaging during the curing process and in service. Understanding the development of these deleterious stresses is necessary for improving predictive models and engineering design. Here, we present a suite of metrologies and methodologies, including advanced thermal analysis, rheological characterization, shrinkage, and evolved stress measurements, to link residual stress development with fundamental material properties in a commercial liquid encapsulant.