6.4Tbps, 224Gbps/Lane Co-Packaged Optical Engines With Fine Pitch Through-Package Interconnects: Powering AI/ML and Next-Gen Data Centers

We introduce a compact, high-performance 6.4 Tbps, 224 Gbps/lane wafer-level co-packaged optical engine, designed for $\text{AI} / \text{ML}$ and next-generation data center applications. This 3D package integrates discrete prefabricated fine-pitch vias in glass as through-package interconnects, enabling ultra-low-loss signal transmission and supporting data rates of up to 448 Gbps/lane.