Test Complexity in the Semiconductor Landscape

As semiconductor technology advances, the complexity of integrated circuits and the introduction of innovative packaging technologies present significant challenges for test processes. This paper provides an overview of the test methodologies used to ensure functionality, performance, and reliability across the product lifecycle. We explore how emerging packaging technologies; such as 2.5D, 3D stacking, and advanced system-in-package (SiP) approaches; complicate traditional test strategies due to increased interconnect density, heterogeneous integration, and thermal management concerns. Furthermore, we discuss the evolving landscape of test, including the adoption of design-for-test (DFT), Automated Test Equipment (ATE), Built-In Self-Test (BIST), and Over-the-Air (OTA) Testing techniques to address these complexities. The paper concludes with insights into future test methodologies, highlighting the need for adaptive, cost-efficient, and high-coverage solutions to meet the demands of next-generation semiconductor devices. This paper aims to equip industry and academic professionals with a comprehensive understanding of current challenges and emerging trends shaping the future of semiconductor testing.