Fast Machine Learning Based Prediction for Temperature Simulation Using Compact Models

As transistor densities increase, managing thermal challenges in 3D IC designs becomes more complex. Traditional methods like finite element methods and compact thermal models (CTMs) are computationally expensive, while existing machine learning (ML) models require large datasets and a long training time. To address these challenges with the ML models, we introduce a novel ML framework that integrates with CTMs to accelerate steady-state thermal simulations without needing large datasets. Our approach achieves up to 70 × speedup over state-of-the-art simulators, enabling real-time, high-resolution thermal simulations for 2D and 3D IC designs.¹¹This research was partially funded by the NSF CCF 2131127 grant