Investigation of Crosstalk Noise in a Tri-Interconnect Model Using Pristine and Copper Interconnects With Different Technologies and Wire Spacings

This study addresses crosstalk noise in the tri-interconnect model using pristine graphene nanoribbons (GNRs) and copper interconnects with various device technologies (16nm, 22nm, 32nm and 45nm PTM-HP model) and different wire spacings. Here, we have demonstrated the performance of pristine GNR and copper interconnects in terms of noise peak calculation and power consumption estimation. From the analysis, it is observed that pristine GNR interconnect performs better than copper interconnect when the technology nodes decrease in size. The noise peak generated by pristine GNR is ~×2 times lesser than copper interconnect and power dissipation is ~×2.34 to 3.43 times lesser than copper interconnect with wide wire spacing variation. In summary, this research effort contributes to the ongoing design of high-performance VLSI systems by providing an updated assessment of crosstalk noise reduction methods and a promise of new interconnect materials such as pristine GNRs.