Fault Isolation and Failure Analysis Challenges in Advanced Packages (Invited)

This paper provides a comprehensive review of the challenges associated with fault isolation (FI) and failure analysis (FA) techniques for advanced packaging technologies, including 2.5D and 3D packages. A generic FI-FA flow is proposed with detailed illustration of FI-FA techniques used in die-level and package-level fault isolation, high resolution imaging, die removal, delayering, cross-section, micro probing, electron microscopy, and material analysis. Additionally, current capabilities and future development trends in Artificial Intelligence (AI) assisted FI and FA methodologies are also highlighted.