An Efficient SI/PI Co-optimization and Analysis Method for High-Speed Pin Arrays Design

To address the challenges of signal and power integrity in high-density interconnects, this paper presents a novel microwave analysis and intelligent optimization framework for high-speed link pin arrays design. A hybrid modal cascade (HMC) method incorporating the generalized T-matrix approach and the partial element equivalent circuit method is proposed to analyze the signal integrity of multi-layer structure with arbitrary shapes, which facilitates the rapid S-parameters calculation for trace-connected via arrays in advanced package. With the empirical formula of pin mutual inductance, a novel physics-assisted multi-objective genetic algorithm framework, designated as HMC-PMGA, is further introduced to optimize both pin arrangement and array parameters, ensuring compliance with both signal and power integrity requirements. Finally, results from various real-world high-speed link array configurations demonstrate the efficiency and reliability of the proposed algorithm, showing great potential for application in the electromagnetic integrity design of integrated circuits.