A New Subassembly Concept for Enhanced Heat Dissipation and Reliability of Power Module

We propose a new subassembly concept that structurally enhances heat dissipation and reliability by monolithically integrating multiple silicon carbide (SiC) chips on a single plate and encapsulating them with molding resin. This subassembly is designed to be a universal solution for SiC modules that can be adapted to various module configurations. In this study, we specifically verify this concept by assuming a de facto standard module of a 6-in-1 full-bridge circuit with a pin-fin structure, which is widely used for xEVs, and partially reproducing its module shape. We validate the heat dissipation performance through detailed thermal simulations and the reliability through power cycle tests of an actual sample module. The research results demonstrate the potential of this subassembly to meet the high thermal and reliability requirements of the xEV market.