Dielectric Two-Phase Cooling Solution for High Power Compute Systems

This paper will present the results of an internal development program where a pumped two-phase cooling system was demonstrated to cool a 200kW thermal load from numerous server blades and racks utilizing a centralized coolant distribution unit (CDU). The CDU was ultimately cooled using facility water and utilizes a dielectric two-phase cooling fluid for direct-to-chip cooling. Cold plate assemblies for each server blade and both in-rack and overhead fluid manifolding solutions have been demonstrated to reliably distribute fluid to each parallel server blade and rack.