A Holistic Approach to Investigate Failure Effects for Analysing Functional Safety and Cybersecurity in Semiconductors

Ensuring functional safety and cybersecurity in automotive applications is a pressing concern in nowadays. The complexity of systems with safety-critical functionalities poses a challenge for effective verification approaches to reduce the gaps between safety and cybersecurity. Semiconductors are pivotal to automated driving systems due to their role in implementing complex functionalities. Therefore, it is essential to consider both Functional Safety (FuSa) and Cybersecurity aspects when developing semiconductor devices. This paper presents a holistic approach to incorporating failure effects and modes that considers both FuSa and Cybersecurity. Additionally, it investigates the potential relationship between failures effects and/or attack effects in semiconductors and emphasizes the interplay between FuSa and cybersecurity in an analysis. By illustrating proposed co-analysis concept between these areas, this study aims to provide insights into ensuring comprehensive FuSa and Cybersecurity measures in semiconductor development for automotive applications.