Solder-Reflow Resistant Thermoplastic Resin Single-Mode Micro-Lens Array for Integrated Photonic Packaging

We demonstrate a pluggable optical coupling between a fibre array and a photonic integrated circuit (PIC) using single-mode microlens arrays (MLAs) moulded from a solder-reflow resistant thermo-plastic resin. This demonstration offers a potential for co-packaged optics, with easy to scale, and rela-tively low cost MLAs.