Film Assisted Molding Performance Improvement with Component Design

System-in-Package (SiP) consist of passive components and wire bond transistor die is growing rapidly in the market. It is offering a more complete solution device with comprehensive electrical performance at a lower unit cost. In this paper, a SiP package which has exposed heatsink and while IO pad exposed at the opposite of the package is studied. The uniqueness of the package structure is requiring a new molding technology, which is film assisted molding (FAM). FAM is a technology uses a film to laminate the IO metal pad through molding process and allowing the IO pads to be exposed after encapsulation process completed. This solution is known to be the most cost-effective manufacturing process, but it had inevitable process risk, which are mold flash and solder extrusion which formed solder beads. DMAIC process is carried out with a series of studies and modelling analysis to tackle these 2 main concerns. A thorough analysis technique include cross section (mechanical and ion milling), materials SEM & EDS, X-ray are performed. In parallel, process with reject mapping was carried out to form the hypothesis. 6 sigma method include source of variation (SOV) study and design of experiment (DOE) are ran to complete the cause-and-effect matrix. Finite element analysis (FEA) also used to understand the mold flow behavior against the thick component also known as brick. Through the join efforts from multi-disciplinary DMAIC team members, a robust brick and FAM process is introduced to support the new package qualification.