Assembly of Multi-Device Power Package with Clips as Interconnects

High heat dissipation design is crucial for high power devices to prevent overheated occurring on the devices during operation. To package a multi-devices module with metal clips can improve heat dissipation through large metal clip surface. However, to assemble a multi-chip module with a total 12 pcs of clips in this study is challenging. In this study, clips shift causing short to adjacent clips after reflow process was observed initially, after the approach of using a proper jig, clips horizontally shift issuers was resolved, and planarity of the clips reduced from ~600μm to ~200μm. Pressure sintered silver (Ag) paste used also achieved shear strength of more than 20Mpa.