Revitalizing Advanced Packaging in America

The resurgence of advanced semiconductor packaging technologies in the United States is crucial for sustaining the nation's position as a global leader in technology. As demands for high-performance computing, artificial intelligence (AI), and energy-efficient electronics intensify, the importance of advanced packaging has grown exponentially. Technologies such as 2.5D and 3D integration, heterogeneous integration, and chiplet architectures are reshaping the semiconductor landscape by enabling unprecedented levels of performance and power efficiency. However, the decline of domestic packaging capabilities over recent decades has left a gap in the U.S.'s ability to meet these demands. To address these challenges, initiatives such as the CHIPS and Science Act have been launched, providing significant funding to reshore manufacturing capabilities and stimulate public-private partnerships. These collaborations between academia, industry, and government institutions aim to overcome technical barriers, such as thermal management, interconnect scaling, and material innovation. The ultimate goal is to build a resilient domestic ecosystem that can respond to the growing demand for advanced packaging technologies across critical applications, including AI systems, data centers, and mobile devices. This article explores the historical trajectory of U.S. semi- conductor packaging, highlighting technological advancements, the role of government initiatives, and ongoing challenges. By examining the intersection of policy, innovation, and industry, this study proposes actionable strategies for revitalizing advanced packaging and ensuring the United States remains at the forefront of the global semiconductor industry.