Introduction To Power Tunnel Innovation In PCB & Package For Better Platform Power Delivery

Intel's "Project EVO" represents a leap forward in compact PC design, focusing on maximizing space efficiency and performance within laptops. Central to this initiative is the reduction of component sizes, with a special emphasis on streamlining the power delivery system. By minimizing the footprint of power planes on Printed Circuit Boards (PCB), it makes room for critical elements such as cooling fans and battery packs. Our key innovation is the power tunnel concept, which transforms PCB and package design. This approach consolidates power planes from adjacent layers into a singular power tunnel, increasing the current carrying capacity and improves load line while simultaneously allowing for a more compact form factor. This breakthrough aids in improving power integrity and cost reduction (by decreasing the number of package layers and PCB board size). Both the board and package prototypes have successfully integrated the power tunnel innovation without incurring fabrication risks. The board design's power performance has been confirmed, and data collection for the package design is underway, with results expected by the second half of 2024. The power tunnel method is set to be a transformative development in the realm of compact PC design, marking a significant stride towards more powerful PC.