Investigation on the Radiation Emission Characteristics of Printed Circuit Boards with Integrated Isolation Chip

Isolation technology is widely used in high-low voltage transformation and long-distance transmission to effectively improve the reliability of the system. However, the imperfect design of the transformer inside the isolation chip may lead to an interference path between the primary and secondary coils of the transformer, which causes radiation emission. Accordingly, in this current work, the radiation emission characteristic of the printed circuit board (PCB) was investigated by simulation analysis and experimental tests. The main radiation sources in isolation chip were extracted, and the electromagnetic interference (EMI) radiation model was developed in electromagnetic simulation software to analyze the maximum radiation intensity of the PCB. A series of experimental tests are conducted to validate the electromagnetic field model. The results of this study provide a better understanding of the radiation emission characteristic of isolation chips and theorical support for improving the electromagnetic compatibility in the electronic system.