Hybrid solution based on ceramic 3D printing for thermal management in power application

Wide band Gap components such as GaN HEMTs have high dI/dt values, on the order of 100A/ns. This means that the presence of parasitic inductances in the circuit can cause overvoltages, resulting in component failure. In addition, high currents are concentrated on very small components, resulting in overheating of components and assemblies. So, when systems require more power, designers turn to ceramic power modules instead of pcb. However, the use of power modules generates higher costs and makes system routing more complex, as multilayer systems are no longer possible. The solution proposed here is to combine a hybrid pcb/ 3D ceramic approach that combines cost and ease of routing offered by pcb with the thermal and insulating properties offered by ceramics.