Electrothermal Coupling Optimization Method of a 3-D Microsystem Based on the Fast Dual-Cell Method

In recent years, due to the increase in power density and thermal accumulation, electrical and thermal reliability have become the main challenges in microsystem design, which requires rapid prediction of the electrical and thermal characteristics of a microsystem. To address these challenges, this study proposes a fast dual-cell method (FDCM) for the electrothermal coupling of 3-D microsystems. By decomposing the constitutive matrix and extracting the temperature variation parameters, the proposed method reduces the number of unknowns of temperature variation iteration, thus ensuring the calculation accuracy while significantly improving the calculation efficiency at a lower memory consumption. Compared with the finite element method (FEM) method, the calculation error of the FDCM is decreased by 1%, the calculation time is reduced by 63.70%, and the calculation memory is only 12.86% of that of the FEM. Finally, this study optimizes the layout of 3-D microsystems using the FDCM, addressing the electrothermal coupling problem.