A Novel Compact Magic-Tee Using Substrate Integrated Fin-Line Technology

A novel magic-tee using substrate integrated finline (SIFL) technology is proposed in this letter. To overcome the integration challenges posed by the traditional waveguide magictee structure, which requires installation within a waveguide cavity, the SIFL magic-tee has been proposed. By using the substrate integrated suspended line (SISL) structure of the air cavity, miniaturization and self-packaging of the fin-line magic-T have been achieved. Based on HFSS simulation validation, the proposed compact SIFL magic-tee has advantages of selfpackaging, low loss, lightweight, and easy integration with planar circuits. Within the frequency range of 8GHz to 10GHz, the insertion loss between the input port and the output port is around 3dB, the isolation between output ports is better than 15dB. The return loss of all ports is better than 10dB.