Multilayer Ceramic Capacitor Source Model Application in Acoustic Noise Prediction

In this article, a multiphysics modeling methodology is presented for predicting the acoustic noise induced by a multilayer ceramic capacitor (MLCC) in mobile electronic devices. The modeling process involves using a prescribed methodology to extract the equivalent source at the resonance frequencies of a printed circuit board (PCB) and then deriving the broadband source multiphysics electrical input mechanical output (EIMO) model. Subsequently, the obtained EIMO model is integrated into PCB vibration simulations, and the resulting vibration data are used for acoustic simulations. The predicted A-weighted sound pressure level excited by the MLCC EIMO model accurately represented the acoustic noise generated by a tested MLCC, achieving a correlation with measurements of 2 dB difference at resonant modes. This approach offers insights into mitigating MLCC-induced acoustic noise in electronic systems and facilitates more effective design strategies.