EMC Improvement of a Double-Sided Printed-Circuit Board

Crosstalk reduction ways in printed-circuit board (PCB) inter—connections are considered and corresponding experimental results are given. A principle of the circuit board construction on the base of double-sided PCB located over the metal plate combining functions of a back signal conductor, an electron components carrier and a heat conductor is developed. It is shown, that using of such a board made on the base of conventional double-sided PCB technologies can give possibilities to reduce and control crosstalk values of high density interconnections, to improve the cooling of electron components by means of the metal plate heat conductivity and to provide the necessary environmental protection and proper electromagnetic shielding for the whole functional electronic block package.