High Power Laser Sub-mount of DPC Ceramic for Edge Emitting Laser Applications

High-power laser systems play a crucial role in industrial, scientific, and medical fields, where the stability of their performance directly impacts the reliability and efficiency of systems. The purpose of this research is to develop a novel high -power laser ceramic substrate by enhancing its thermal management, conductivity, and durability through the selection of suitable materials and precise manufacturing processes to meet the demands across various applications. The study utilized high thermal conductivity aluminum nitride ceramic substrates as the foundational material, achieving a thermal conductivity of 230 W/m.K, effectively dissipating heat and enhancing system thermal stability. In the metallization process, direct electroplating of copper technology is employed. Initially, copper electroplating is applied to the surface of the ceramic substrate, followed by electroplating with nickel gold on the copper surface. Alternatively, electroless immersion nickel/palladium/gold plating with additional electroless thick gold plating is utilized to ensure the conductivity and corrosion resistance of the metal layer. Subsequently, low-temperature annealing was conducted to further modify the crystal structure of the metal layers, thereby improving their stability, mechanical strength, and heat resistance. Finally, during the manufacturing process of evaporated gold-tin solder, photolithographic processes were employed to precisely control the shape and position of the solder, preventing solder overflow and ensuring the precision and reliability of laser chip bonding. The developed high-power laser ceramic substrate demonstrated outstanding performance after the manufacturing process. Firstly, the aluminum nitride ceramic substrate effectively enhanced the overall system's heat dissipation capability, thereby decreased heat accumulation and system temperature rise. The precise manufacturing and annealing processes of the metal layers ensured stability and durability under prolonged high-power operations while providing excellent electrical performance. The photolithographic process designed for solder shape and precise position control effectively prevented solder overflow during the manufacturing process, further ensuring reliable laser chip bonding and connection. This research successfully developed a high-power laser ceramic substrate, enhancing overall system performance and reliability through the precise design and optimization of materials, metallization processes, and solder manufacturing. Future research directions include further optimizing manufacturing processes to enhance product efficiency and cost-effectiveness to meet the growing demands of high-power laser applications.