NiPdAu top Metal for Clip and Cu/Au Wire Bonding in a Hybrid Package

Electroless plated metal, such as electroless nickel electroless palladium immersion gold (ENEPIG Ni/Pd/Au) [1], [2] is a promising candidate for solder-based device interconnects. As it only deposits on the metal pads, it can be used for packages having both clip and wire bonding. This study focuses on evaluating the manufacturability and reliability of NiPdAu plating in the power device package that enables both clip and wire integration. These devices were observed to be capable of meeting the reliability requirements of the consumer mission profile. As a result, this investigative approach is beneficial for the risk evaluation of NiPdAu plating in these packages.