Pre-fabricated Via Array Substrate for Programmable AIoT Applications

A pre-fabricated via array substrate and the customized redistribution traces are designed to provide small-volume large-variety production packaging producibility evaluation. The pre-fabricated via array substrate was composed of three-metal level copper redistribution layers and 200 μm height copper post. An active switch die was embedded in the copper post, it can programmable and modulate the signal transmission between integrated heterogeneous chips. We demonstrate a high-functionality package that interconnects multiple chips (Bluetooth, flash memory, and microcontroller unit) into a single system using simple 2P1M customized redistribution traces, reducing the complexity of layout design and increasing routing flexibility. It can be a cost-effective packaging, customized redistribution traces process in a short cycle time using existing via array substrate. The proposed pre-fabricated via array substrate and the customized redistribution traces for fan-out wafer-level packaging are expected to be a promising solution for high-performance system-in-package architectures. Advanced pre-fabricated via array substrate can guarantee the manufacturing yield, shortening the time-to-market, and reducing the production cost.