Mature Defect-Free Micro Processing for Advanced IC Substrates

The semiconductor industry is constantly evolving, driven by the demand for higher performance, greater miniaturization, and increased integration density in electronic devices. Traditional organic and ceramic substrates, while effective, are increasingly challenged by the requirements of modern high-performance applications such as AI and high-performance computing (HPC). Glass substrates have emerged as a promising alternative due to their superior thermal stability, electrical performance, and mechanical strength. However, the brittleness of glass and its susceptibility to defects have historically limited its use in high-volume semiconductor manufacturing.